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| Hiring Company | UTAC Japan 株式会社 |
| Location | Kyoto Prefecture |
| Job Type | Permanent Full-time |
| Salary | 9 million yen ~ 14 million yen |
【求人No NJB2319921】
詳しくご面談時にお伝えをさせていただきます。
| Minimum Experience Level | No experience |
| Career Level | Mid Career |
| Minimum English Level | Fluent |
| Minimum Japanese Level | Native |
| Minimum Education Level | Bachelor's Degree |
| Visa Status | Permission to work in Japan required |
・ Engineering Degree with 10+ years minimum work experience preferably in the sub con semiconductor industry or equivalent in IC assembly related companies or semiconductor environment.
・ Must have experience working with advanced packages
・ Good knowledge of FOL (front of line)and EOL (end of line) assembly operations
・ Preferably to have a Test engineering experience
・ Well versed in SPC and DOE
・ Must have strong verbal written interpersonal communication and presentation skills both in Japanese and English. Must enjoy working with others highly organized ability to take initiative/task orientated work with minimum supervision.
・ Must be a team player comfortable working with cross functional teams across geographic boundaries with experience in leading teams and managing projects.
| Job Type | Permanent Full-time |
| Salary | 9 million yen ~ 14 million yen |
| Work Hours | 08:30 ~ 17:15 |
| Holidays | 【有給休暇】入社7ヶ月目には最低10日以上 【休日】完全週休二日制 |
| Industry | Electronics, Semiconductor |
| Company Type | International Company |