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Power Assembly Engineer（パワーデバイスパッケージ）
| Hiring Company | iSoftStone |
| Location | Tokyo - 23 Wards |
| Job Type | Contract |
| Salary | 4.5 million yen ~ 6.5 million yen |
Job Description
1. 高度なパワーエンカプラーシステム（材料およびプロセス）の開発を担当する
2. エンカプラー材料の専門家に対して、定期的なプロジェクトタスクの追跡をサポートできる
3. 材料の納品および分析作業において、専門家をサポートできる
4. 実験設計をサポートし、結果をまとめることができる
General Requirements
| Minimum Experience Level | Over 1 year |
| Career Level | Mid Career |
| Minimum English Level | Daily Conversation |
| Minimum Japanese Level | Business Level |
| Minimum Education Level | Bachelor's Degree |
| Visa Status | Permission to work in Japan required |
Required Skills
More than 2 years related working experience in encapsulate material/equipment/process technology development.
Job Location
- Tokyo - 23 Wards
Work Conditions
| Job Type | Contract |
| Salary | 4.5 million yen ~ 6.5 million yen |
| Industry | Chemical, Raw Materials |
Job Category
- Electronics and Semiconductor Technology Jobs > Other (Electronics and Semiconductor Technology)
- Chemical, Food and Materials Technology Jobs > R&D (Chemical, Food, Textile, Other Materials)
Company Details
| Company Type | Large Company (more than 300 employees) - International Company |
| Non-Japanese Ratio | About half Japanese |
