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【茨城】半導体製造装置（ウェーハ面取り関連）のアプリケーションエンジニア
| Hiring Company | 東京証券取引所プライム市場に上場・半導体製造装置と精密計測機器の製造販売 |
| Location | Ibaraki Prefecture, Tsuchiura-shi |
| Job Type | Permanent Full-time |
| Salary | 6.5 million yen ~ 8 million yen |
Job Description
【概要】
ウェーハ面取り機を使用した加工技術開発業務
具体的には、
・ウェーハ研削面取り機を使用し新しい加工プロセスの研削評価
・ウェーハ研削面取り装置を使用し加工提案・企画・加工プロセスの開発
・ウェーハ研削面取り装置を使用しお客様から依頼の面取り研削加工
【年俸】
645万円～795万円
【勤務地】
茨城県土浦市
General Requirements
| Minimum Experience Level | Over 3 years |
| Career Level | Mid Career |
| Minimum English Level | Daily Conversation (Amount Used: English usage about 10%) |
| Minimum Japanese Level | Native |
| Minimum Education Level | Bachelor's Degree |
| Visa Status | Permission to work in Japan required |
Required Skills
【必要職務経験】
・Office系ソフト等のPC使用が行える方、かつ装置と加工工具を使用し加工評価の経験のある方
【歓迎職務経験】
・工学系（機械工学）出身の方
・研削装置を使用し研削評価の経験のある方
・英語での会話経験がある方
Job Location
- Ibaraki Prefecture, Tsuchiura-shi
Work Conditions
| Job Type | Permanent Full-time |
| Salary | 6.5 million yen ~ 8 million yen |
| Holidays | 完全週休2日制（土・日）、祝、年間休日128日 |
| Industry | Machinery |
Job Category
- Machinery and Automobile Technology Jobs > Architect, Development Engineer Jobs
- Machinery and Automobile Technology Jobs > Production Engineering (Machinery, Automobile) Jobs
- Machinery and Automobile Technology Jobs > Other (Machinery and Automobile Technology)
Company Details
| Company Type | Large Company (more than 300 employees) |
