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【大阪市内】３D CAD機械設計／半導体運搬装置の設計エンジニア（Junior Engineer／Osaka）
| Hiring Company | 株式会社Parker TAIYO |
| Location | Osaka Prefecture, Osaka-shi Higashodogawa-ku |
| Job Type | Permanent Full-time |
| Salary | 4.5 million yen ~ 7.5 million yen |
Job Description
半導体ウェハー搬送装置の3D CADを使用した設計業務を担当いただきます。
◎主な業務：仕様設計、詳細設計、設計変更提案、図面の確認、関係部門や顧客との折衝・調整など
◎使用CAD：iCAD
年に数回客先への出張があります。
General Requirements
| Minimum Experience Level | Over 1 year |
| Career Level | Mid Career |
| Minimum English Level | None |
| Minimum Japanese Level | Business Level |
| Minimum Education Level | Technical/Vocational College |
| Visa Status | Permission to work in Japan required |
Required Skills
・3D CADでの機械設計経験（使用CAD不問）
・日本語ネイティブレベル
Job Location
- Osaka Prefecture, Osaka-shi Higashodogawa-ku
- Kyoto Main Line, Aikawa Station
Work Conditions
| Job Type | Permanent Full-time |
| Salary | 4.5 million yen ~ 7.5 million yen |
| Salary Bonuses | Bonuses included in indicated salary. |
| Salary Commission | Commission included in indicated salary. |
| Work Hours | 8:30～17:05 |
| Holidays | 土日祝日、GW・夏季・年末年始休暇（会社カレンダーあり・年1日程度土曜出勤日あり） |
| Job Division | -- |
| Industry | Machinery |
Job Category
- Machinery and Automobile Technology Jobs > Architect, Development Engineer Jobs
- Machinery and Automobile Technology Jobs > Other (Machinery and Automobile Technology)
Company Details
| Company Type | Large Company (more than 300 employees) - International Company |
