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Location | Taiwan, |
Job Type | Permanent Full-time |
Salary | Negotiable, based on experience |
Company and Job Overview
As the Director of Application Engineering, you will lead global technical engagements with OEMs in the high-performance electronics sector. You’ll manage a team providing expert consultation on PCB stack-up design, materials selection, signal integrity, thermal performance, and qualification test plans. Your role is crucial in converting complex customer needs into manufacturable, high-performance solutions aligned with company strategies and product capabilities.
Responsibilities
Customer-Focused Support
Lead global OEM engagements for PCB stack-up design, material selection, and performance simulation.
Serve as a technical liaison during design-in cycles and new product adoption phases.
Oversee design guidelines, test protocols, and material documentation.
Strategic & Technical Leadership
Develop and implement a global application engineering strategy to support growth, product differentiation, and customer satisfaction.
Collaborate with Product Management, Sales, R&D, and Operations on stack-up capabilities, signal integrity, and thermal reliability.
Team Management
Lead and develop a global team of application engineers and technical field resources.
Create scalable processes for modeling, test plan development, and failure analysis.
Technology & Standards Leadership
Maintain expertise in advanced materials like high-speed, low-loss laminates, and thermally conducive prepregs.
Represent the company in standards bodies and customer forums.
Collaboration and Influence
Partner with OEMs to co-develop validation plans and facilitate new design engagement.
Ensure technical alignment across global sites for consistent application engineering services.Top of Form
Qualifications
15+ years in Application Design within industries like advanced materials, semiconductors, electronics, automotive, or aerospace.
Experience with global laminate or PCB manufacturing.
Familiarity with IPC/JEDEC protocols and failure analysis methodologies.
Bachelor’s in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. A Master’s (M.S. or M.Eng) or MBA with a strong technical background is preferred.
Certifications in signal integrity, thermal management, or high-speed digital design are advantageous.
Fluent in English for business and technical communication.
Proficiency in Mandarin Chinese is strongly preferred for collaboration with OEMs and technical teams in China and Taiwan.
Additional language skills are a plus.
Catherine Qu
JAC Recruitment Pte Ltd
EA Personnel: R22104823
EA Personnel Name: QU QIUSHI
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Minimum Experience Level | No experience |
Career Level | Mid Career |
Minimum English Level | None |
Minimum Japanese Level | None |
Minimum Education Level | Associate Degree/Diploma |
Visa Status | No permission to work in Japan required |
Job Type | Permanent Full-time |
Salary | Negotiable, based on experience |
Industry | Electronics, Semiconductor |