Lead Electronic Engineer【Automotive EE Dev, Project Mgmt】

＜Position　Lead Electronic Engineer＞
　
　【Overview】

• Responsible for controller development and project management in the electrical/electronics (EE) domain for automotive roof systems (sunroofs and convertibles). Lead EE projects, including customer presentations, while balancing delivery schedules, quality, and cost.

   【Detailed Examples】

• Addressing regulatory, functional safety, and security requirements; serving as technical liaison
• Collaborating with overseas development sites in English to advance design and testing
• Creating system and test specifications; managing risks and changes
• Coordinating with customers, factories, and suppliers; consolidating production requirements

Recruitment Background:Replacement

Department size: ：Engineering Team 4 members (excluding managers)

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Employment Type
　Full-time employee

Annual Salary
　7.3 million yen or more (annual salary position, including bonuses)

Work Location
　Webasto Japan Co., Ltd.
   5-10 Taguchi Research Complex, Higashi-Hiroshima City, Hiroshima 739-0038 Japan

Working Hours
　Standard working hours: 9:00 – 17:45 (actual working time: 8 hours / break time: 45 mins)
   Flextime system (no core time)
　Overtime Hours：Approximately 10-15 hours per month

Holidays
　Holidays: Follows the company calendar
   Annual: 124 days (Breakdown) Saturdays, Sundays, New Year holiday, GW holiday, Summer holiday

必須スキル Necessary qualifications

• 5+ years of EE development experience in the automotive field
  (hardware/software/requirements specification)
• Project management and hands-on experience
• Practical English usage experience (technical communication skills via documents and conversation)

歓迎スキル Preferred qualifications

Candidates with experience/skills in either hardware or software are welcome:

• Schematic design experience
• PLM (Product Lifecycle Management) experience in product releases

• Software requirements decomposition and analysis skills
• Embedded software coding experience using Embedded-C

Education

• Bachelor's degree (electronic engineering) or above preferred

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Selection Process (3 rounds including document screening)
Document screening
First interview (Hiroshima HQ, in-person or via Microsoft Teams, conducted in Japanese)
Final interview (Hiroshima HQ, in-person, conducted in both English and Japanese)