CareerCross uses cookies to enhance your experience on our websites. If you continue to view our sites without changing your browser settings, then it is assumed that we have your consent to collect and utilise your cookies. If you do not want to give us your consent, then please change the cookie settings on your browser. Please refer to our privacy policy for more information.
CareerCross uses cookies to enhance your experience on our websites. If you continue to view our sites without changing your browser settings, then it is assumed that we have your consent to collect and utilise your cookies. If you do not want to give us your consent, then please change the cookie settings on your browser. Please refer to our privacy policy for more information.
Hiring Company | 外資系デバイスメーカー |
Location | Osaka Prefecture |
Job Type | Permanent Full-time |
Salary | 10 million yen ~ 20 million yen |
【求人No NJB2224778】
・高性能パワーデバイス(SiC MOSFET/SBD、GaN HEMT、Si IGBT)のデザイン開発とテスト検証を担当し、プロセスチームと協力してデバイス加工とプロセスの最適化を行う。
・高性能パワーデバイス(SiC MOSFET/SBD、GaN HEMT、Si IGBT)の個別技術をフォローアップし、既存のデバイスの性能を向上させ、パテントポートフォリオを提案して実現させる。
Minimum Experience Level | No experience |
Career Level | Mid Career |
Minimum English Level | Business Level |
Minimum Japanese Level | Native |
Minimum Education Level | Bachelor's Degree |
Visa Status | Permission to work in Japan required |
Job Type | Permanent Full-time |
Salary | 10 million yen ~ 20 million yen |
Work Hours | 09:00 ~ 18:00 |
Holidays | 【有給休暇】有給休暇は入社後4ヶ月目から付与されます 初年度 14日 4か月目から 【休日】完全週休二日制 土 日 夏季休暇 … |
Industry | Communication |
Company Type | International Company |