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Hiring Company | メーカー |
Location | Tokyo - 23 Wards |
Job Type | Permanent Full-time |
Salary | 5 million yen ~ 10 million yen |
【求人No NJB2135709】
・同社のセンサー、通信関係製品の組込ソフトウェア設計・開発をご担当頂きます。
■業務内容
情報機器の組込ソフトウェア設計のプロジェクトマネージャーをご担当頂きます。
ソフトウェア開発領域の多様化による開発体制強化のための募集です。
■業務詳細
・自動販売機、センサ等の設計
・AI設計、画像認識設計、クラウド(AWS)設計、波形解析アルゴリズム設計
・UI・UXデザイン など
Minimum Experience Level | No experience |
Career Level | Mid Career |
Minimum English Level | Daily Conversation |
Minimum Japanese Level | Native |
Minimum Education Level | High-School or Below |
Visa Status | Permission to work in Japan required |
Job Type | Permanent Full-time |
Salary | 5 million yen ~ 10 million yen |
Work Hours | 08:30 ~ 17:20 |
Holidays | 【有給休暇】入社7ヶ月目には最低10日以上 【休日】完全週休二日制 土 日 祝日 GW 夏季休暇 年末年始 3ヶ月勤務後、就業… |
Industry | Electronics, Semiconductor |