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Hiring Company | 大手半導体デバイスメーカー |
Location | Gunma Prefecture |
Job Type | Permanent Full-time |
Salary | 8 million yen ~ 10 million yen |
【求人No NJB2113032】
【職務内容】
SiCパワー製品(モジュール含む) の商品企画・仕様設計
・対象製品:
SiCまたはIGBTを使ったパワーデバイス(モジュール含む)
・主担当業務:
パワーデバイスの応用システムを扱う部署において,SiCまたはIGBT(モジュール含む)の商品企画および仕様設計を行うリーダ的な業務。
その他に,リファレンスデザインやデモシステムの企画/開発、新製品の商品企画活動(ビジネスプラン,仕様策定,技術動向調査)、顧客へのプロモーション活動やトラブルシューティングにおける技術支援活動
Minimum Experience Level | No experience |
Career Level | Mid Career |
Minimum English Level | Daily Conversation |
Minimum Japanese Level | Native |
Minimum Education Level | Bachelor's Degree |
Visa Status | Permission to work in Japan required |
Job Type | Permanent Full-time |
Salary | 8 million yen ~ 10 million yen |
Work Hours | 08:30 ~ 17:15 |
Holidays | 【有給休暇】初年度 23日 1か月目から 【休日】完全週休二日制 土 日 祝日 夏季休暇 年末年始 【有給休暇】入社月に付与(… |
Industry | Electronics, Semiconductor |