【外資系半導体メーカー】カスタマーエンジニア｜名古屋

外資系大手半導体グループ傘下の半導体ファウンドリ企業にて、国内外の顧客と製造拠点をつなぐカスタマーエンジニアを募集しています。

顧客の半導体開発・試作段階から技術面でサポートし、社内の製造エンジニアと連携しながら、共同開発プロジェクトや量産立ち上げを推進します。PDK（プロセス・デザイン・キット）などの半導体設計支援環境の管理・提供にも携わるポジションです。

半導体プロセスやウェハ製造の知識を活かし、顧客との技術折衝から設計・製造の橋渡しまで、専門性を発揮できます。海外顧客との連携や、約3か月に1回の海外出張機会もあります。

• 国内外の顧客への技術対応： 国内外のファウンドリ顧客の技術窓口として、技術的な問い合わせや開発要件の確認・調整を担当する。約3か月に1回の海外出張あり。
• 半導体開発・試作の技術支援： 顧客の開発・試作段階において、製造拠点のエンジニアと連携しながら技術的な課題解決を支援する。
• 共同開発プロジェクトの推進： 顧客との共同開発を進め、半導体設計データの製造引き渡し（テープアウト）から量産立ち上げまでのプロジェクトを管理する。
• 設計支援環境の管理： PDK（プロセス・デザイン・キット）をはじめ、半導体設計に必要な技術情報や設計支援ツールの提供・管理・調整を行う。
• 業務プロセスの改善： 技術サポート体制や顧客アカウント管理の業務フローを改善し、サービス品質の向上に貢献する。

Join a world-class semiconductor foundry specialising in advanced 300mm wafer fabrication as a Customer Engineer (Foundry Technical Account & Project Management) in Nagoya, Japan. This permanent opportunity combines semiconductor engineering expertise, international technical account management and customer-facing project coordination within an established manufacturing organisation.

You will act as the primary technical interface between domestic and international semiconductor customers and internal wafer fabrication teams, ensuring that technical requirements are clearly understood and effectively supported throughout development and prototyping programmes.

The role focuses on semiconductor foundry engineering, Process Design Kits (PDKs), design enablement, IC development support and technical project management, offering exposure to advanced semiconductor manufacturing technologies and global customer relationships.

A key responsibility will be supporting joint development programmes, coordinating engineering activities and helping customers progress smoothly through semiconductor design, tape-out and production ramp-up.

You will manage and coordinate the delivery of semiconductor design technology information, PDKs and design enablement assets, ensuring that customers receive the technical resources required for their development activities.

Working closely with fab engineering facilities and internal technical teams, you will provide practical engineering support during prototype development, address customer technical requirements and facilitate effective communication across organisational boundaries.

The position also involves international customer engagement, including periodic overseas business travel approximately once every three months.

As the organisation continues to expand, you will contribute to improvements in technical account management processes, customer engineering workflows and service capabilities, helping strengthen the foundry's ability to support global semiconductor customers.

This role is ideal for professionals with experience in semiconductor engineering, wafer manufacturing, process integration, IC design, foundry customer support or technical account management who want to develop their expertise in a globally connected manufacturing environment.

• Serve as the principal technical contact for domestic and international semiconductor foundry customers.
• Manage technical communications and coordinate customer requirements across engineering, manufacturing and commercial stakeholders.
• Undertake overseas business travel approximately once every three months to support international customer relationships and technical discussions.
• Provide comprehensive engineering support throughout semiconductor development and prototyping phases.
• Collaborate closely with wafer fabrication engineering facilities to address technical challenges and support customer development programmes.
• Coordinate joint development initiatives and technical project execution, ensuring effective alignment between customers and internal engineering teams.
• Support successful semiconductor tape-out and production ramp-up through proactive technical coordination.
• Deliver, manage and coordinate Process Design Kits (PDKs), semiconductor design technology information and design enablement assets.
• Facilitate clear communication of technical requirements, design-related information and engineering deliverables to relevant stakeholders.
• Identify and address customer technical issues while coordinating appropriate support from internal specialists.
• Contribute to improvements in technical account management workflows and customer engineering service processes.
• Support the continued development of customer-facing engineering capabilities as the organisation expands.
• Build effective working relationships with domestic customers, international semiconductor partners and internal manufacturing teams.
• Maintain accurate technical documentation, project updates and customer communications using standard business tools.

必須条件 経験・資格：

• 理学・工学・技術系分野の修士号以上
• 半導体業界におけるエンジニアリング関連の実務経験
• PCスキル： Excel、PowerPoint、Word（技術資料・報告書、顧客向け文書の作成など）

• 主体性・自走力： 複雑な顧客の技術要件を理解し、自ら考えて主体的に対応できること
• 部門横断の調整力： 顧客と社内の製造・技術部門の間に立ち、円滑なコミュニケーションと合意形成を進められること
• 問題解決力： 顧客の技術的な課題や要望を正確に把握し、社内の技術・製造部門と連携しながら、最適な解決策を導き出せること

• 日本語：流暢
• 英語：ビジネスレベル（海外顧客との英文メール対応、業務調整あり。TOEIC 500点以上目安）

• プロセス統合やウェハ製造に関する実務経験、半導体製造プロセスの知識：
• 半導体設計会社（Design House）やIDM（垂直統合型半導体メーカー）での技術サポート、IC設計経験など、顧客向けの技術サポート経験：
• OSAT（半導体後工程受託企業）やIDM、外部パートナーとの技術的な交渉・調整経験
• 中国語力（海外拠点や中国語圏の顧客とのコミュニケーション対応のため）

世界有数の半導体ファウンドリ企業です。

日本国内に300mm（12インチ）ウェハ対応の先進的な製造拠点を持ち、国際的な半導体グループを背景に、ロジック半導体、組み込み不揮発性メモリ、パワー半導体関連の製造ソリューションを提供しています。

世界各国の主要なテクノロジー企業の半導体開発・製造を支えています。

※カスタマーエンジニアリング・マネージャーの求人はこちら

• グローバルな半導体開発に携われる： 国内外の大手半導体メーカーと協働し、国際的な開発プロジェクトに参加できます。
• 設計から製造まで幅広い技術知識を習得： PDKや設計支援技術、ウェハ製造プロセスなど、半導体開発を支える専門知識を深められます。
• 共同開発・量産立ち上げを推進： 顧客と製造拠点の橋渡し役として、試作から量産化まで一連のプロジェクトに携われます。
• 海外顧客との技術折衝・海外出張： 海外顧客との直接的な技術コミュニケーションに加え、約3か月に1回の海外出張機会があります。
• 年間休日126日・転勤なし： 完全週休2日制に加え、年間有給休暇23日、フレックスタイム制を導入。会社都合による転勤もありません。
• 充実した福利厚生： カフェテリアプラン、確定拠出年金、社員貯蓄制度、地域手当・住宅手当などを利用できます。

• Master's degree or higher in Science, Engineering, Technology or a related technical discipline.
• Demonstrated practical engineering experience within the semiconductor industry.
• Understanding of semiconductor engineering processes and technical customer requirements.
• Ability to coordinate technical activities between semiconductor customers and internal engineering or manufacturing teams.
• Advanced proficiency with Microsoft Excel, PowerPoint and Word for technical documentation, reporting and customer communications.
• Capability to manage technical project information, customer requirements and engineering deliverables accurately and independently.
• Ability to support engineering discussions and resolve technical coordination challenges within a semiconductor manufacturing environment.

• Proactive working style and strong sense of ownership, with the ability to manage complex customer technical requirements independently.
• Excellent cross-functional communication and stakeholder alignment skills.
• Ability to bridge the needs of semiconductor customers, wafer fabrication engineers and internal technical teams.
• Strong organisational and project coordination skills to manage technical information and development activities effectively.
• Collaborative approach to technical problem-solving and customer relationship management.
• Clear and professional communication skills when handling technical negotiations and international customer discussions.
• Adaptability and willingness to contribute to continuous improvements in customer engineering services and processes.

• English: Minimum TOEIC 500 or above, with strong business reading and writing skills for email correspondence, technical negotiations and international coordination.
• Japanese: Fluent proficiency for effective communication with domestic customers and internal manufacturing teams.

• Conversational to fluent Chinese language proficiency for communication with international customers and partners.
• Practical experience in semiconductor process integration.
• Hands-on experience in wafer manufacturing or semiconductor fabrication processes.
• Experience providing customer technical support within a semiconductor business.
• IC design experience gained at a semiconductor Design House or Integrated Device Manufacturer (IDM).
• Direct experience in technical negotiations and project coordination with Outsourced Semiconductor Assembly and Test (OSAT) or IDM partners.
• Familiarity with semiconductor development workflows, PDKs, design enablement or tape-out coordination.

Our client is an established world-class semiconductor foundry operating advanced 300mm wafer fabrication facilities in Japan.

Supported by an international parent semiconductor group, the company combines specialised semiconductor manufacturing capabilities with access to global technical expertise and industry networks.

Its technology portfolio includes specialised logic semiconductor solutions, embedded non-volatile memory and power semiconductor technologies.

The organisation serves leading global technology innovators, supporting the development and manufacturing of advanced semiconductor products.

Its foundry engineering teams work closely with customers to support semiconductor design enablement, prototype development, wafer fabrication and production readiness.

The company places importance on technical collaboration, reliable manufacturing operations and responsive customer engineering support, enabling effective coordination between external customers and internal fabrication specialists.

Joining this organisation offers the opportunity to work with advanced semiconductor manufacturing technologies and internationally recognised customers, while building a long-term engineering career in Japan.

• Join a world-class semiconductor foundry operating advanced 300mm wafer fabrication facilities.
• Work within an established business backed by an international semiconductor group.
• Gain exposure to specialised logic, embedded non-volatile memory and power semiconductor technologies.
• Play a key role in international customer engineering and semiconductor technical account management.
• Support joint development programmes, semiconductor tape-out and production ramp-up.
• Build expertise in Process Design Kits (PDKs), design enablement and semiconductor manufacturing workflows.
• Collaborate with global semiconductor customers and specialised wafer fabrication engineers.
• Develop international business experience through overseas travel approximately once every three months.
• Enjoy an excellent work-life balance with 126 annual days off.
• Benefit from 23 days of annual paid leave.
• Take advantage of flexible flextime working arrangements.
• Enjoy long-term location stability through a company policy of no forced relocation.
• Access a customisable Cafeteria Plan offering a range of employee welfare benefits.
• Benefit from a Defined Contribution Corporate Pension Plan.
• Take advantage of employee savings schemes.
• Receive applicable regional and housing allowances.
• Build a long-term career in Japan's semiconductor manufacturing industry through a permanent position in Nagoya.