PR/118642 | DIP Asst. Mgr,

Position:   DIP Assistant Manager

Location:  Bangpoo, Samutprakan

Responsibilities:

• Oversee and manage the entire Through-Hole Technology (THT) or DIP (Dual In-line Package) assembly process, including component preparation, manual insertion (plug-in), hand soldering, and/or wave soldering operations.

• Lead capacity planning and resource allocation (manpower, equipment) to ensure production targets and deadlines are met efficiently within the DIP area.

• Responsible for the setup, troubleshooting, and maintenance of specialized DIP machinery such as Wave Soldering machines, lead cutting machines, and soldering stations.

• Manage and develop the DIP production team, providing training and guidance to operators on standard soldering techniques (e.g., IPC-A-610 standards) and strict ESD prevention protocols.

• Analyze and resolve quality issues specific to the DIP process (e.g., cold joints, solder bridges, insufficient solder) to continuously improve the overall production yield rate.

• Act as the primary liaison between the DIP production team and other departments, including Manufacturing Engineering, Quality Control (QC/QA), and Maintenance, ensuring smooth operational flow and adherence to specifications.

• Initiate and drive process improvement projects utilizing methodologies like Lean or Six Sigma to reduce waste, lower production costs, and enhance the overall efficiency of the DIP production line.

Qualifications:

• 7 years up MFG experience + PCBA

• Knowledge of production efficiency improvement
• Knowledge of production and stock balance control

• Ability of cost control 

  SMT background is plus