【外資系半導体ファウンドリ】プロセスエンジニア｜三重

大規模な300mmウェハ製造環境で、次世代パワーデバイスや先端ファウンドリ技術の量産化を支えるプロセスエンジニアを募集しています。

半導体プロセスの開発・改善から量産立ち上げまで、幅広い工程に携わりながら、歩留まり向上や生産性向上など、製造技術の高度化を推進します。

300mmファウンドリの大規模な量産環境で専門性を高めながら、競争力のある報酬と年2回の業績賞与、年間休日126日・年間23日の有給休暇など、充実した待遇と働きやすさを両立できるポジションです。

• リソグラフィ、エッチング、拡散、CMP、CVD、PVD、イオン注入など、主要な半導体モジュール工程における量産プロセスを開発・支援
• 先端ファウンドリ向けの半導体製造プロセス統合を推進
• 付加価値の高いファウンドリ製品の拡大に向け、プロセス設計および製造装置の管理を担当
• 特殊なファウンドリ製品および次世代パワーデバイスの量産立ち上げをリード
• 歩留まり向上、プロセス安定化、生産性向上、コスト削減に向けた製造技術を開発・改善
• ファウンドリ事業全体における半導体プロセスおよび製造装置について、技術面から幅広くサポート

Join an established semiconductor foundry as a Semiconductor Process Engineer, developing and optimising advanced module processes and high-volume manufacturing technologies for 300mm wafer fabrication.

In this role, you will work across core semiconductor manufacturing processes including lithography, etching, diffusion, CMP, CVD, PVD and ion implantation. You will contribute to module technology integration, yield improvement, equipment management and mass-production ramp-up for advanced foundry applications.

You will also play an important role in developing manufacturing technologies for next-generation power devices and high-value-added foundry options, helping improve process stability, productivity and cost efficiency.

This is an excellent opportunity for an experienced semiconductor engineer to deepen their expertise in process development, process integration and high-volume manufacturing within a large-scale 300mm wafer fabrication environment.

• Develop and support high-volume semiconductor manufacturing processes across lithography, etching, diffusion, CMP, CVD, PVD and ion implantation.
• Execute semiconductor process integration activities for advanced foundry applications.
• Develop and optimise module-level process technologies for 300mm wafer fabrication.
• Design manufacturing processes and manage related equipment to expand high-value-added foundry options.
• Lead and support mass-production ramp-up for specialised foundry technologies and next-generation power devices.
• Develop and refine manufacturing technologies to improve yield and process stability.
• Drive productivity improvements and cost-reduction initiatives across semiconductor manufacturing operations.
• Provide technical support for semiconductor processes and manufacturing equipment across the foundry business.
• Collaborate with relevant engineering and manufacturing teams to resolve technical issues and support stable mass production.

必須条件経験・資格：

• 以下いずれかの工程におけるプロセス開発、プロセス統合、または量産立ち上げの実務経験：縦型炉 / ウェハ洗浄 / イオン注入 / 1枚ウェハRTP
• 半導体プロセス開発、またはモジュールレベルのプロセス技術に関する実務経験
• パワーデバイス開発、製造技術、生産技術、または後工程プロセス開発の実務経験
• 半導体技術および製造原理に関する基礎的な理解
• 高等専門学校（高専）卒以上、かつ関連する技術分野を専攻していること

• 担当業務に主体的に取り組み、オーナーシップを持ってプロジェクトを前に進める力
• 新しい半導体技術を積極的に学び、継続的に知識・スキルを高める姿勢
• 関係者と円滑に連携し、技術的な課題や情報を共有しながら業務を進める力

• 日本語：流暢
• 英語：初級（TOEIC 500点以上、または業務で英語を使用した実務経験があれば尚可）

• 半導体製造業界での実務経験

大規模な300mmウェハ製造工場を運営する、半導体受託製造の専門企業です。

国際的なファウンドリグループの支援を受け、ロジック、モジュール、パワーデバイスなどの半導体技術をグローバル市場に提供しています。

先端ファウンドリ技術の開発から量産まで幅広く手掛け、次世代パワーデバイスを含む高付加価値製品の製造を支えています。

大規模な量産環境の中で、半導体プロセス、モジュールインテグレーション、歩留まり改善、製造技術、装置管理など、幅広い技術領域に携われる環境です。

• 次世代パワーデバイスと300mmファウンドリ技術の開発・量産化に携われる
• 半導体プロセス開発から量産立ち上げまで、幅広い経験を積める
• 昇給制度が整っており、競争力のある報酬を実現
• 年2回の業績賞与
• 残業代は1分単位で支給
• フレックスタイム制度・年間休日126日による充実したワークライフバランス
• 長期休暇制度に加え、年間23日の有給休暇

• Practical experience in semiconductor process development, process integration or process ramp-up.
• Hands-on experience involving one or more of the following: vertical furnaces, wafer cleaning, ion implantation or single-wafer RTP.
• Demonstrated experience in semiconductor process development or module-level process technology.
• Hands-on background in power device development, manufacturing engineering, production technology or back-end process development.
• Technical college (KOSEN) graduation or higher in a relevant discipline.
• Solid foundational understanding of semiconductor technologies and manufacturing principles.

• Strong sense of ownership with the ability to take responsibility for assigned projects and drive them forward.
• Proactive mindset and willingness to continuously learn new semiconductor technologies.
• Strong problem-solving approach when addressing manufacturing and process challenges.
• Ability to work effectively with engineering and manufacturing teams.
• Commitment to improving process stability, yield, productivity and manufacturing performance.

• Japanese: Fluent level.
• English: TOEIC 500+ or practical experience using English in a business environment.

• Previous professional experience within the semiconductor manufacturing industry.
• Experience working in a semiconductor foundry or high-volume wafer fabrication environment.
• Experience with 300mm wafer manufacturing.
• Knowledge or experience across lithography, etching, diffusion, CMP, CVD, PVD or ion implantation.
• Experience with advanced semiconductor module integration.
• Experience developing or manufacturing power semiconductor devices.
• Experience supporting mass-production ramp-ups, yield enhancement or process optimisation.

Our client is an established contract semiconductor manufacturer operating large-scale 300mm wafer fabrication facilities.

Supported by an international foundry group, the company provides advanced semiconductor technologies across logic, module and power devices for global markets.

Its large-scale manufacturing environment provides semiconductor engineers with opportunities to contribute to advanced process development, technology integration and high-volume production while helping bring next-generation semiconductor technologies into mass production.

• Drive key technical innovations for next-generation power devices and advanced 300mm foundry solutions.
• Play an important role in semiconductor process development and mass-production ramp-up.
• Build expertise across module integration, yield enhancement, manufacturing technology and equipment management.
• Work within a large-scale 300mm semiconductor wafer fabrication environment.
• Receive competitive compensation with structured salary progression.
• Benefit from performance bonuses twice a year.
• Receive overtime compensation calculated on a minute-by-minute basis.
• Maintain excellent work-life balance with flex-time options and 126 annual holidays.
• Enjoy long seasonal holidays and 23 days of annual paid leave.