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| Location | Malaysia, Selangor |
| Job Type | Permanent Full-time |
| Salary | Negotiable, based on experience |
COMPANY OVERVIEW
JOB RESPONSIBILITIES
Develop and qualify Power QFN (PQFN) packaging processes for new products.
Support production ramp-up and ensure manufacturing readiness.
Improve yield, quality, capacity, and manufacturing costs.
Work with customers, suppliers, and internal teams to resolve technical issues.
Support product transfers from development/NPI stage to mass production
JOB REQUIREMENTS
Bachelor's Degree in Engineering, Physics, Materials Science, Chemistry, or a related field.
Strong experience in semiconductor process engineering, package development, or advanced packaging technologies.
Hands-on experience and knowledge in PQFN/Power QFN, Cu Clip, Thin Die, Wire Bonding, and SPS (Smart Power Stage).
Proven experience in Package Development, including qualification and process optimization activities.
Experienced in managing projects from NPI (New Product Introduction) through to Mass Production, with strong problem-solving and stakeholder management skills.
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| Minimum Experience Level | Over 3 years |
| Career Level | Mid Career |
| Minimum English Level | Business Level |
| Minimum Japanese Level | None |
| Minimum Education Level | Associate Degree/Diploma |
| Visa Status | No permission to work in Japan required |
| Job Type | Permanent Full-time |
| Salary | Negotiable, based on experience |
| Industry | Other (Manufacturing) |