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| Hiring Company | 非公開 |
| Location | Kanagawa Prefecture |
| Job Type | Permanent Full-time |
| Salary | 6 million yen ~ 7.5 million yen |
【求人No NJB2412983】
■業務内容
半導体パッケージ基板用層間絶縁材料の開発として以下業務を担当いただきます
・新規ABFの配合、開発
・顧客に対するテクニカルサポート
| Minimum Experience Level | No experience |
| Career Level | Mid Career |
| Minimum English Level | Business Level |
| Minimum Japanese Level | Native |
| Minimum Education Level | Post Grad Degree (PHD/MBA etc) |
| Visa Status | Permission to work in Japan required |
■必須要件
◇学歴:大学院修士以上
◇語学力:英語でのビジネス文書および科学論文の作成および読解が可能であること
◇スキル:
・有機化学かつ/または高分子化学の知識とその経験
・有機化学または高分子化学の知見と技術を活かした研究実務経験
■歓迎要件
・樹脂材料の配合技術
・機能性材料の分析や不具合の要因解析に関する広範囲な知識と経験
■求める人物像
・配合検討を進んで実施する積極性のある方
・同僚およびサプライチェーン上の関係者とのコミュニケーションを自発的に行える社交性のある方
| Job Type | Permanent Full-time |
| Salary | 6 million yen ~ 7.5 million yen |
| Work Hours | 08:15 ~ 16:30 |
| Holidays | 詳細は求人ご紹介時にご案内いたします。 |
| Industry | Food and Beverage |