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PR/161031 | PCBA Engineer
| Location | Malaysia, Kedah |
| Job Type | Permanent Full-time |
| Salary | Negotiable, based on experience |
Job Description
Company Overview
Our client is a semiconductor equipment technology company headquartered in Fremont, California, USA. The company specializes in gas flow monitoring and control solutions used in semiconductor wafer fabrication processes. Its products help chip manufacturers improve process accuracy, yield, and production efficiency.
Key Responsibilities:
Develop, evaluate, and optimize PCBA manufacturing processes, including SMT, DIP, wave soldering, reflow soldering, and final assembly, to improve production efficiency, reduce cycle time, and minimize defects and material waste.
Provide technical support to production by monitoring assembly processes, identifying bottlenecks, troubleshooting process and equipment issues, performing root cause analysis, and implementing effective corrective and preventive actions (CAPA).
Equipment & Process Setup
Establish and maintain process control standards to ensure products meet IPC, customer, and regulatory requirements.
Key Requirements:
Bachelor's Degree in Electronic Engineering, Electrical Engineering, Manufacturing Engineering, Mechatronics Engineering, or a related discipline.
Minimum 3 years of experience in PCBA manufacturing, SMT/DIP production, process engineering, or electronics manufacturing.
Strong knowledge of PCBA manufacturing processes.
Good communication skills.
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General Requirements
| Minimum Experience Level | Over 3 years |
| Career Level | Mid Career |
| Minimum English Level | Basic |
| Minimum Japanese Level | None |
| Minimum Education Level | Associate Degree/Diploma |
| Visa Status | No permission to work in Japan required |
Job Location
- Malaysia, Kedah
Work Conditions
| Job Type | Permanent Full-time |
| Salary | Negotiable, based on experience |
| Industry | Other (Manufacturing) |
