PR/097823 | 2.5D / 3D Assembly Engineer

We are seeking a highly skilled 2.5D / 3D Assembly Engineer to support the development and implementation of advanced semiconductor packaging and integration technologies. This role will focus on wafer-level packaging, 2.5D/3D assembly processes, package design optimization, reliability engineering, and advanced technology development.

The successful candidate will play a key role in driving innovation, improving assembly methodologies, collaborating with external partners, and developing next-generation packaging solutions for advanced semiconductor applications.

• Lead the development and optimization of advanced semiconductor packaging and assembly technologies, including 2.5D and 3D integration.

• Support package design, assembly process development, and Design for Manufacturing (DFM) and Design for Test (DFT) initiatives.

• Perform thermo-mechanical, electrical, and reliability analysis using simulation and modeling tools.

• Investigate and resolve packaging, assembly, and reliability challenges across various operating environments.

• Collaborate with cross-functional teams, suppliers, and manufacturing partners to drive technology development and process improvements.

• Conduct failure analysis, root-cause investigations, and reliability assessments to improve product performance.

• Support the introduction of new materials, packaging technologies, and assembly methodologies.

• Contribute to technical documentation, design guidelines, and continuous improvement initiatives.

• Master's or PhD in Mechanical Engineering, Materials Science, Physics, Semiconductor Packaging, Micro/Nanofabrication, or a related discipline.

• Strong hands-on experience in semiconductor assembly, packaging, or advanced integration technologies.

• Experience with wafer-level packaging, 2.5D/3D packaging, and advanced assembly processes.

• Knowledge of semiconductor package structures, materials, manufacturing processes, and reliability considerations.

• Familiarity with CAD tools and thermo-mechanical simulation methodologies.

• Experience with Finite Element Modeling (FEM) for thermal, mechanical, or electrical analysis.

• Strong understanding of assembly-related failure mechanisms and reliability engineering.

• Excellent analytical, troubleshooting, and engineering problem-solving skills.

• Solid understanding of material properties, physics fundamentals, and package behavior across varying environmental conditions.

• Experience developing Process Design Kits (PDKs) or packaging design flows.

• Knowledge of Through-Silicon Via (TSV), silicon processing, and thin-film technologies.

• Experience with cryogenic testing or low-temperature electro-mechanical characterization.

• Exposure to high-voltage or power semiconductor packaging qualification.

• Background in process engineering, manufacturing engineering, or advanced packaging development.