PR/161112 | Staff Process Engineer

A leading global semiconductor organization is seeking a Staff Process Engineer to drive advanced packaging development and high-volume manufacturing for power semiconductor products. This role focuses on Power QFN (PQFN) and Cu clip-based thin die assembly processes, supporting both new product introduction and sustaining engineering. You will play a critical role in optimizing assembly processes, improving yield and cost efficiency, and ensuring robust production performance while collaborating closely with cross-functional teams and external manufacturing partners.
 

Key Responsibilities

• Lead package development and process qualification for PQFN (Power Quad Flat No-Lead) packages and Smart Power Stage (SPS) products.

• Develop and optimize assembly processes for thin wafer handling, die attach, and Cu clip technologies.

• Drive high-volume manufacturing ramp-up and qualify new production sources to meet capacity and demand requirements.

• Own sustaining engineering activities, continuously improving yield, quality, capacity, and cost performance.

• Collaborate with Product, Test, Quality, and Operations teams to resolve internal and customer-reported issues.

• Lead root cause analysis and implement corrective and preventive actions for process-related challenges.

• Manage and maintain Product Lifecycle Management (PLM) documentation to ensure accuracy and compliance.

• Drive suppliers change management initiatives to improve manufacturing robustness, scalability, and cost efficiency.

• Apply statistical methods (SPC, data analysis) to monitor performance and drive continuous improvements.
   

Key Requirements

• Bachelor’s degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences (or related discipline).

• Proven experience in semiconductor process engineering or advanced packaging development.

• Strong experience with PQFN, QFN, WLCSP, or similar package technologies.

• Knowledge of thin wafer handling, die attach, and Cu clip assembly processes (especially for power devices).

• Understanding of quality and reliability requirements for semiconductor packaging.

• Hands-on experience with statistical process control (SPC) and data analysis tools (e.g., JMP).

• Strong problem-solving, analytical, and project management skills.

• Effective communication and stakeholder management skills in a cross-functional environment.

• Ability to manage complex projects and drive outcomes in a fast-paced manufacturing environment.