PR/160031 | Field Application Engineer

A global technology provider specializing in advanced test solutions for the semiconductor industry. Our teams support leading foundries, IDMs, and OSATs across multiple regions, helping customers tackle next‑generation wafer‑level testing challenges.

Key Responsibilities
Provide on-site technical support for probe card installation, setup, debugging, and engineering evaluations.
Support internal and external teams during product qualification, NPI activities, and production ramp cycles.
Collaborate directly with customer Test, Process, and Equipment Engineers to address technical issues and optimize test performance.
Coordinate debug cycles, failure analysis, and corrective actions with internal engineering teams.
Prepare and deliver technical reports, FA summaries, and content for customer presentations in partnership with the sales team.
Identify upsell opportunities (spares, rebuilds, upgrades, new platforms) and support technical proposals, RFQs, and feasibility discussions.

Job Requirements
Bachelor’s degree or diploma in Engineering (Electrical, Mechatronics, Science, Physics, Product & Materials) or a related field, with 3–5 years of experience in wafer test–related product or process engineering.
Strong hands-on troubleshooting mindset with solid analytical and problem‑solving skills, including familiarity with yield and failure analysis concepts.
Basic understanding of wafer probe / wafer sort processes, preferably with experience in wafer‑level testing or probe card technologies (Cantilever, Vertical, MEMS; WLT/WFT flows).
Experience working with or supporting OSATs, foundries, or IDMs is highly preferred.
Excellent communication abilities to clearly explain complex technical issues, with strong coordination skills across sales, engineering, and manufacturing teams.
Comfortable working in cleanroom and fab/OSAT environments, fluent in English and Chinese, and willing to travel for on‑site customer support.