求人ID : 1073393 更新日 : 2020年10月26日
Making A Material Difference

Field Applications Engineer/フィールド・アプリケーション・エンジニア

採用企業 Veeco Japan Co., Ltd
勤務地 広島県
勤務形態 正社員
給与 経験考慮の上、応相談

募集要項

Responsibilities:

  1. Engage closely with customer on anneal applications and improve process performance
  2. Develops and maintains best known methods (BKM) for process control, process development and continuous improvement. Drive adoption of BKMs
  3. Communicates and participates in technical trainings regularly with product lines to enhance professional knowledge and to gather up-to-date product information
  4. Understanding of business requirements and plan activities needed to support
  5. Clear communication with customer, field and factory

応募必要条件

職務経験 1年以上
キャリアレベル 中途経験者レベル
英語レベル 日常会話レベル
日本語レベル ネイティブ
最終学歴 大学卒: 学士号
現在のビザ 日本での就労許可が必要です

スキル・資格

  1. Bachelor or Master degree in Engineering, Physics, Materials Science, Chemistry.
  2. Minimum 2 years in Semiconductor Industry experience
  3. Travel 20%
  4. Relocation available

勤務地

  • 広島県

労働条件

勤務形態 正社員
給与 経験考慮の上、応相談
採用企業情報

ビーコ・ジャパン株式会社

Field Applications Engineer/フィールド・アプリケーション・エンジニア - 1073393

会社概要

会社の種類 大手企業 (300名を超える従業員数) - 外資系企業

会社説明

Making a Material Difference is at the core of our DNA. For more than 30 years, we have developed differentiated technologies and built expertise and know-how that has enabled world-changing devices such as LED lighting, data storage, advanced computing and mobile devices to reach industrial scale. We help customers overcome technical and cost barriers that make it possible to convert novel materials into high-yielding device performance at production volumes. Our customers produce the newest, fastest, smallest, and most efficient electronic components used in devices to help deliver a better world.

We serve the semiconductor and emerging high-growth markets. Our process equipment and technology are used to manufacture advanced semiconductors, LEDs, displays, photonics, VCSELs, power electronics, compound semiconductors, hard disk drives, MEMS and wireless chips.